Electronic Engineering
PCB Fabrication and Assembly
From Materials Science to Additive Manufacturing
- 81 pages
- 2026
- pt
Most designers hand over the file and never see the board again until it comes back assembled. This book is about what happens in between — and it is written by someone who was there: before he was a designer, the author was an industrial maintenance technician on the machines of a printed circuit fabrication and assembly line.
Twelve chapters on the board’s journey after the software: the science of materials and substrates, the DfM and DfA rules that decide whether the board can be built at all, inner-layer processing, lamination, drilling and plating, solder mask and surface finish, paste deposition and SMT, the soldering processes, inspection and quality control, IPC standards and certification, project and supply-chain management and, at the end, additive manufacturing and 3D-printed electronics.
It is the book that explains why a design that passes DRC can still come back from the factory wrong — and what to change in the design so that it does not. Whoever designs gains the vocabulary to talk to the factory; whoever works in the factory gains the reason behind every step.
In this book
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01 Materials science and substrates
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02 Design for Manufacturing (DfM) and Design for Assembly (DfA)
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03 Inner-layer processing and lamination
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04 Drilling and plating
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05 Solder mask and surface finish
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06 Solder paste deposition and SMT
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07 Soldering processes
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08 Inspection and quality control
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09 IPC standards and certification
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10 Project and supply-chain management
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11 Emerging technologies
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12 Additive manufacturing and 3D-printed electronics
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